As AI models grow, data-centre compute density keeps rising, and pluggable optical modules are meeting limits in bandwidth, power, signal loss and space. CPO and NPO have become important routes for next-generation high-speed interconnect.
SZCIA, together with elexcon Shenzhen International Electronics and Embedded Exhibition, held the AI Data Centre Optics Seminar on 10 September 2026 at Shenzhen World Exhibition and Convention Center, from 13:00 to 17:00.
The programme covered optical-electrical integration and connector technology in CPO scenarios, super-node SNPO specifications and open co-development, 224G LGA NPO sockets, copper-optics co-packaging, NPO interconnect testing, the evolution of high-speed optical interconnects and test redesign, and material innovation for large-model infrastructure.
The seminar aimed to close information gaps across the supply chain, clarify technical routes, discuss multi-standard compatibility and accelerate NPO deployment in AI data centres.
Compiled by the committee. Data and conclusions follow the original sources; please credit when republishing.
Source：SZCIA official website · Advanced Basic Materials Committee
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